EmotionEngine® And Graphics Synthesizer Used In The Core Of PlayStation® Become One Chip
PlayStation®2 CPU and Graphics Chip Becomes One with 90 Nanometer Process
Tokyo, April 21, 2003 – Sony Computer Entertainment Inc. (SCEI) announced today that it would be the first in the industry to start advanced semiconductor production with 90 nanometer embedded DRAM process in FY2003. With the installation of this advanced semiconductor technology, SCEI will integrate the company’s two main semiconductors, EmotionEngine® and Graphics Synthesizer, CPU and graphics processor used for PlayStation®2, into one chip.
This new ultra highly-integrated semiconductor will have a total of 53.5 million transistors with enhanced low power-consumption and at a reduced cost. Mass production with 90 nanometer embedded DRAM process leads ITRS, the industry standard roadmap of semiconductor technologies, and comes six months ahead of others in the industry. Production of the new semiconductor will start from this spring in Oita TS Semiconductor (OTSS), a joint venture between SCEI and Toshiba Corporation, and in the fall in Fab, SCEI’s own semiconductor fabrication facility in Isahaya City, Nagasaki Prefecture.
Since 1999, SCEI’s Fab and OTSS have jointly invested approximately 300 billion yen. Starting with 180 nanometer process, further enhancements have been made at both facilities, with the introduction of 90 nanometer process fabrication line currently taking place. The world’s highest productivity with 180 – 140 nanometer embedded DRAM process and logic process is achieved in their respective facilities and the introduction of mass production with 90 nanometer embedded DRAM process further accelerates the company’s endeavor to achieve the very highest standards in semiconductor fabrication.
With PlayStation and PlayStation 2, Sony Computer Entertainment will create and develop a new world of computer entertainment for the broadband era through the fusion of game, music, movies, and broadcasting.
New Semiconductor Specification
EE: 128bit RISC
GS: Parallel rendering processor with embedded DRAM
Process: 90 nanometer
Total number of transistors: 53.5 MTr.
Embedded DRAM: 4MB
Memory size: 0.19μm2
Clock frequency: 294.912MHz
Power consumption: 8Watts (initial power consumption was 37Watts two chips total)
Metal layer: 5
Die size: 86mm2 (initial die size was 413 mm2 two chips total)
Package: 536pin EBGA
About Sony Computer Entertainment Inc.
Recognized as the global leader and company responsible for the progression of consumer-based computer entertainment, Sony Computer Entertainment Inc. (SCEI) manufacturers, distributes and markets the PlayStation® game console and PlayStation®2 computer entertainment system. SCEI, along with its subsidiary divisions Sony Computer Entertainment America Inc., Sony Computer Entertainment Europe Ltd. and Sony Computer Entertainment Korea Inc., develops, publishes, markets and distributes software, and manages the third party licensing programs for these two platforms in the respective markets worldwide. Headquartered in Tokyo, Japan, Sony Computer Entertainment Inc. is an independent business unit of the Sony Group.
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